CS-FLUX reballing Low viscosity liquid flux for BGA component rework reflow 15g . Ideal for VGA GPU repairs

CS-FLUX when heated at around 150 degrees (Celsius) turns into liquid and covers the small gap between the BGA component and the PCB complitelly. This way all solder balls are covered with CS-FLUX and durring reflow or removal of the BGA componets all PCB and componet pads and balls are protected. CS-FLUX is no clean flux but if needed it can be cleaned very easily with alcohol. It causes no corossion on the PCB or components. Thank’s to it’s liquid nature, a very small amount of CS-FLUX is needed for each repair resulting in a much cleaner work enviroment.

CS-FLUX is also Lead Free CS-FLUX is very sticky and specially designed to keep the solder balls inside the stencil durring the reballing proccess. It is also ideal for reflow of BGA components (with heatgun) when needed equipment for reballing is not avaliable. CS-FLUX is produced in EU (Greece) and will be shipped to your workshop very fast. Flux designed for BGA reballing or reflow. CS-FLUX is a low viscosity flux designed by C. S. labs research team, to cover the special needs in flux usage on repairs (reballing or reflow of GPUs and other BGA components) of commercial electronics such as laptops, gaming consoles etc.

Packet contains: 3 syringe X 5g (15g in total) of CS-FLUX 3 X 1.6 mm tips for easy application 1 X container box where the product should be stored You can see our instructions video (for application of CS-FLUX before reflow or GPU removal) on our youtube page » ComputerSystemsGR «. Price includes VAT 23%. If you are VAT registered in EU please contact us before purchasing and we will offer a quote without VAT. Greek business customers should provide their business info in order to issue a commercial invoice. CS-FLUX is produced in EU (Greece) and is shipped directly from our production center in Thessaloniki Greece. Important notice! This product is designed for industrial use ONLY. It should be used only by technitians with experience on BGA component rework.